发明名称 PACKAGE CONNECTOR DEVICE
摘要 PURPOSE:To improve a high frequency transmission characteristic by supporting a connector main sit to one surface of a printed board, displacing the center of the connector main unit to one side of the printed board, and forming a type with no through hole required, so as to eliminate discontinuity of characteristic impedance. CONSTITUTION:Point end parts 14c to 17c of tongue parts 14b to 17b, extended, of contacts 14 to 17 are formed in an SMT type by directly connecting upper side two rows to wiring patterns 21, 22 in a surface 12s of a printed board 11 and lower side two rows to wiring patterns 23, 24 in a reverse surface 12r of the board 11, respectively without passing through holes. A structure is formed by regularly arranging the respective upper/lower sides with an equal space alternately on one straight line. In this way, while maintaining interchangeability with a through hole dip type, discontinuity of characteristic impedance is eliminated to improve a high frequency transmission characteristic.
申请公布号 JPH05343137(A) 申请公布日期 1993.12.24
申请号 JP19930036241 申请日期 1993.02.02
申请人 NEC CORP 发明人 KOBAYASHI TETSUYA;KATABUCHI KENJIRO;SUZUKI YUMIKO
分类号 H01R12/04;H01R12/20;H01R12/22;(IPC1-7):H01R23/68;H01R9/09 主分类号 H01R12/04
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