| 摘要 |
PURPOSE:To eliminate a special purpose device for forming a bump, to reduce its cost and to improve its yield by bending an end of a lead frame to be electrically connected to wirings on a ceramic board to form bumps. CONSTITUTION:An IC chip 16 is placed at a center on an upper surface of a ceramic board 10 through thermal conductive resin 17, one end of a gold wire 11 is connected to one end of a conductor wiring pattern 15 formed on the board by wire bonding, and the other end is connected to one end of the chip 16. One end of a frame 13 is connected to the other end of the pattern 15, a periphery of the frame 13 on both ends of the board 10 is covered with sealing glass 12, and a window frame 18 is placed on the upper surface. A protruding bump 13a is formed on the end of the frame 13 of the side of the pattern 15, and a bump forming part and its vicinity are covered with a connecting metal layer 14. |
