MANUFACTURE OF LEAD FRAME FOR MULTI-CHIP PACKAGE

摘要

PURPOSE:To simplify manufacturing steps as simple as possible and to further improve positional accuracy of a wiring pattern. CONSTITUTION:An insulating board 9 for placing a semiconductor element is formed in a predetermined size, and connected to a board supporting leads 8 of a die padless lead frame body having no die pad. A wiring pattern A is formed directly on the board 9 connected to the leads 8 by a gas deposition method. The pattern A is formed of a fine pattern made of an ultrafine particle film of metal.