发明名称 SILVER PATTERN AND FORMATION THEREOF
摘要 PURPOSE:To improve contactness between a metal layer for contact such as chromium to be formed on an insulated substrate and a silver layer and prevent alteration at the surface of a silver pattern. CONSTITUTION:Metal layers 2, 12 for contactness such as chromium having excellent contactness with an insulated substrates 1, 11 are formed on the insulated substrates 1, 11, copper layers or nickel layers 3, 13 having excellent contactness with metal layers 2, 12 for contactness and simultaneously with silver layers 4, 14 are also formed thereon, and moreover silver layers 4, 14 are also formed thereon. In this case, a copper layer 15 is formed thereon for use as a patterning mask of the metal layers 2, 12 for contactness such as chromium or the like. After the patterning, at least a part of such copper layer 15 is left to reduce an electrical resistance. An oxygen electrode or glass electrode can be formed by utilizing such silver pattern.
申请公布号 JPH05343396(A) 申请公布日期 1993.12.24
申请号 JP19920145713 申请日期 1992.06.05
申请人 FUJITSU LTD 发明人 SUGAMA AKIO;SUZUKI HIROAKI
分类号 G01N27/404;G01N27/36;H01L21/3205;H01L23/52 主分类号 G01N27/404
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