MANUFACTURE OF MULTILAYER CERAMIC SUBSTRATE

摘要

PURPOSE:To enhance flatness, electric resistance, solder wettability of electronic pattern on the surface of a ceramic multilayer substrate contracting in the thickness direction but not contracting in the plane direction during the baking step for lowering the electric resistance of via electrodes. CONSTITUTION:Special numbers of green sheets 1 comprising glass ceramic containing at least an organic binder, a plasticizer forming electrode patterns 2 of a conductor paste composition are laminated so that an organic resin layer 4 to be vanished during the baking step may be formed on the part of the electronic patterns 2 or via electrodes 3 on both sides or one side of the green sheets l. Later, the other green sheets 5 comprising inorganic composition not to be sintered at the baking temperature laminated on both sides or one side of the laminated body are baked and then the inorganic compositions not yet sintered are removed so as to manufacture the title multilayer ceramic substrate.