| 摘要 |
PURPOSE:To prevent that an insulation defect is caused between cut patterns by a method wherein a molten powder which has adhered in the cutting operation of the patterns is removed by using a laser beam after the patterns have been cut. CONSTITUTION:By means of a control operation from a laser controller 23, pattern parts which are to be cut on a printer wiring board PT are irradiated with a laser beam LB having the prescribed number of pulses from a laser oscillator 21. The pattern parts are volatilized and removed. In this case, a mask-size controller 24 controls a laser-beam mask device so as to narrow a laser-beam irradiation area. Required pattern parts are removed partly; after that, parts on the printed wiring part including the cut parts are irradiated with a laser beam LB which is weaker than that in the cutting operation; a molten powder which has adhered to parts near the cut parts is removed. Thereby, an insulation defect is not caused between the cut patterns. |
