FLIP-CHIP MOUNTING STRUCTURE OF ELECTRONIC COMPONENT,申请号JP19920145122-传众专利搜索

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发明名称	FLIP-CHIP MOUNTING STRUCTURE OF ELECTRONIC COMPONENT
摘要
申请公布号	JPH05343472(A)	申请公布日期	1993.12.24
申请号	JP19920145122	申请日期	1992.06.05
申请人	NEC CORP	发明人	MORI FUMIO
分类号	H01L21/60;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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