Senseur pyroélectrique et procédé de fabrication.

摘要

Components such as pyroelectric sensors which are particularly sensitive to piezoelectric effects and can be adversely affected as a result by any mechanical stress or vibration are described. These adverse effects may be controlled by inserting a flexible silicone sheet (42) between the chip (10) bearing the pyroelectric film and the bottom of the package (30) so that it absorbs package distorsion without passing it on to the chip. Means are provided to enable connecting leads (34) to be ultrasonically welded even though the flexible sheet is present. The chip is preferably attached to a metallized ceramic wafer (40), and abutments (44) are preferably provided at the package bottom to limit compression of the flexible sheet (42) during the welding operation.