| 摘要 |
PURPOSE:To mass-produce semiconductor sensors without damaging beam parts or diaphragm parts which affect the sensitivity of sensor. CONSTITUTION:The semiconductor sensor comprises a central working section 30, a peripheral beam section 31, a diaphragm section 32, a peripheral fixed frame section 33, and a distortion sensitive sensor disposed at the beam section 31, wherein an annular groove 32a is made in the bottom face of a semiconductor board E thus defining the working section 30 and the thick fixed section 33. An auxiliary board F is then bonded and partially cut off through machining thus forming a weight body 34 to be jointed with the working section 30 and a base 35 to be jointed with the fixed section 33. The thick part is then etched from the top face side of the semiconductor substrate E thus forming a thin diaphragm section 32 and beam section 31. The semiconductor board E is subjected to bonding pressure, cutting load, or impact when it is still thick prior to formation of thin diaphragm section 32 or beam section 31, which thereby protected against damage. |
