| 摘要 |
<p>PURPOSE:To prevent a decrease in processing capacity by simultaneously conducting a peripheral exposure of a wafer and an operation of a prealignment. CONSTITUTION:An irradiating unit 6 irradiates a wafer 1 with a light 12 from an optical fiber 10. A CCD sensor 11 is provided at a position opposed to the unit 6 to obtain an output responsive to an amount of a light to be shielded. The unit 6 can detect a position by a linear scale 9. The wafer 1 is held and rotated by a vacuum chuck 2. The chuck 2 and the unit 6 are relatively displaced, and the chuck 2 is moved by X-Y stages 4, 5, thereby simultaneously conducting an operation of a prealignment and a peripheral exposure.</p> |
