发明名称 SEALING METHOD FOR PLANAR ELEMENT
摘要 PURPOSE:Not to deteriorate an element due to a heat at adhering when a metallic foil is adhered to a substrate with thermoplastic resin to protect the element formed in a center of the substrate from an outside. CONSTITUTION:A metallic foil 3 in the peripheral part of a substrate where an element is not formed is instantly heated and simultaneously pressurized by using a high frequency induction heat by coils having a specific shape, and thermoplastic resin 12 is melted between the substrate in the peripheral part and the metallic foil 3 and is gradually cooled to stiffen resin, whereby the element is sealed from an outside without heat-deteriorating the element in a center of the substrate.
申请公布号 JPH05343723(A) 申请公布日期 1993.12.24
申请号 JP19920150322 申请日期 1992.06.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKADA HAJIME;OMORI HIDEKI
分类号 B29C65/42;B29L31/34;H01L31/042 主分类号 B29C65/42
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