发明名称 |
SEALING METHOD FOR PLANAR ELEMENT |
摘要 |
PURPOSE:Not to deteriorate an element due to a heat at adhering when a metallic foil is adhered to a substrate with thermoplastic resin to protect the element formed in a center of the substrate from an outside. CONSTITUTION:A metallic foil 3 in the peripheral part of a substrate where an element is not formed is instantly heated and simultaneously pressurized by using a high frequency induction heat by coils having a specific shape, and thermoplastic resin 12 is melted between the substrate in the peripheral part and the metallic foil 3 and is gradually cooled to stiffen resin, whereby the element is sealed from an outside without heat-deteriorating the element in a center of the substrate. |
申请公布号 |
JPH05343723(A) |
申请公布日期 |
1993.12.24 |
申请号 |
JP19920150322 |
申请日期 |
1992.06.10 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKADA HAJIME;OMORI HIDEKI |
分类号 |
B29C65/42;B29L31/34;H01L31/042 |
主分类号 |
B29C65/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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