发明名称 INSERTING METHOD FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To ensure reliability on insertion without depending upon the magnitude of the quantity of a spring back after the lead of an electronic is molded. CONSTITUTION:Pitches at the time of the molding of leads 18 are set arbitrarily by an electronic component 15 having the leads 18 composed of various wire diameters and materials at both ends to be inserted in the direction of an axial center, and pitches at the time of insertion can be set at fixed pitches. Accordingly, the leads 18 of the electronic component 15 at fixed pitches can be inserted into the inserting holes 23 of a substrate 20 in the optimum quantity of a spring back at all times without depending upon the magnitude of the quantity of the spring back after the leads 18 of the electronic component 15 are molded, thus ensuring high reliability on insertion.
申请公布号 JPH05343894(A) 申请公布日期 1993.12.24
申请号 JP19920145360 申请日期 1992.06.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 WATANABE HIDEAKI;MAE TAKAHARU;IMAI SEI;YAMAGAMI AKIO
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
代理机构 代理人
主权项
地址