发明名称 |
Compact plastics encapsulated charge coupled device unit for mass prodn. - comprises semiconductor chip, lead frame, thin confining wall of thermosetting polymer, glass cover, metal wires, and cast body e.g for camcorder |
摘要 |
The unit has (a) a semiconductor chip which has a CCD and which has contact pads (1a) and a light receiving section (16); (b) a lead frame which is integral with a chip mounting plate (2) and leads (3) having inner (3a) and outer (3b) connections; (c) a thin confining wall (4) of predetermined height, on the chip surface for enclosing the section (16); (d) a glass cover (5) on top of the wall (4) for tightly closing and allowing light passage to the section (1b); (e) metal wires ()6) for electrically connecting the chip contact pads (1a) to the inner connections (3a) of the lead frame; and (f) a cast body (7) for hermetically sealing the chip (1) and the inner connections (3a). Prodn. of the plastics-encapsulated CCD unit is also new. The confining wall (4) pref. comprises a thermosetting polymer which exhibits adhesive properties at the opposite end daces and which is hardened at above 150 deg.C for 1 hr. for bonding to the glass cover (5). The glass cover (5) pref. comprises highly transparent glass with a refractive index of ca. 1.5 and a transmission of at least 90%. USE/ADVANTAGE - The CCD unit is useful in a camcorder. The design allows simple and inexpensive mass prodn. of compact CCD units by transfer casting using an inexpensive plastics (esp. injection mouldable resin). |
申请公布号 |
DE4319786(A1) |
申请公布日期 |
1993.12.23 |
申请号 |
DE19934319786 |
申请日期 |
1993.06.15 |
申请人 |
GOLDSTAR ELECTRON CO., LTD., CHEONGJU, KR |
发明人 |
HUR, KI ROK, SEOUL/SOUL, KR |
分类号 |
H01L23/28;H01L23/29;H01L23/31;H01L27/14 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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