发明名称 Compact plastics encapsulated charge coupled device unit for mass prodn. - comprises semiconductor chip, lead frame, thin confining wall of thermosetting polymer, glass cover, metal wires, and cast body e.g for camcorder
摘要 The unit has (a) a semiconductor chip which has a CCD and which has contact pads (1a) and a light receiving section (16); (b) a lead frame which is integral with a chip mounting plate (2) and leads (3) having inner (3a) and outer (3b) connections; (c) a thin confining wall (4) of predetermined height, on the chip surface for enclosing the section (16); (d) a glass cover (5) on top of the wall (4) for tightly closing and allowing light passage to the section (1b); (e) metal wires ()6) for electrically connecting the chip contact pads (1a) to the inner connections (3a) of the lead frame; and (f) a cast body (7) for hermetically sealing the chip (1) and the inner connections (3a). Prodn. of the plastics-encapsulated CCD unit is also new. The confining wall (4) pref. comprises a thermosetting polymer which exhibits adhesive properties at the opposite end daces and which is hardened at above 150 deg.C for 1 hr. for bonding to the glass cover (5). The glass cover (5) pref. comprises highly transparent glass with a refractive index of ca. 1.5 and a transmission of at least 90%. USE/ADVANTAGE - The CCD unit is useful in a camcorder. The design allows simple and inexpensive mass prodn. of compact CCD units by transfer casting using an inexpensive plastics (esp. injection mouldable resin).
申请公布号 DE4319786(A1) 申请公布日期 1993.12.23
申请号 DE19934319786 申请日期 1993.06.15
申请人 GOLDSTAR ELECTRON CO., LTD., CHEONGJU, KR 发明人 HUR, KI ROK, SEOUL/SOUL, KR
分类号 H01L23/28;H01L23/29;H01L23/31;H01L27/14 主分类号 H01L23/28
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