发明名称 Verfahren zur Metallisierung einer elektrisch isolierenden Oberfläche
摘要 <p>The adhesive strength of, in particular, ductile metal layers bound predominantly by mechanical anchorage to the substrate is enhanced by a controlled increase of the hardness of these metal layers by formation of an alloy or by precipitation hardening, preferably in the zone of the metal layers close to the substrate. This is achieved by means of an interlayer which is applied to the substrates before the application of the metal layer or is effected afterwards by a heat treatment.</p>
申请公布号 DE3512342(C2) 申请公布日期 1993.12.23
申请号 DE19853512342 申请日期 1985.04.04
申请人 DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART, DE 发明人 OSTWALD, ROBERT, DR.-ING., 7900 ULM, DE
分类号 C04B41/90;C23C18/18;C23C28/02;(IPC1-7):C23C18/16;C04B41/51 主分类号 C04B41/90
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