Method of testing continuity of a connection between an IC and a PCB.

摘要

A method of testing the electrical conductivity of a connection between an integrated circuit device (9) and a circuit board (7) to which the device (9) is connected, said device (9) including a current path between a further connection (13) thereto and the connection (15) to be tested, said method comprising the steps of, whilst the circuit is inoperative: applying via said board (7) a potential of a first amount to said further connection (13); applying via said board (7) a potential of a second different amount to the connection (15) being tested; and utilising probe means (5) positioned adjacent said device (9) to sense indirectly current in said current path, the presence of current indicating that the connection (15) being tested is conductive. <IMAGE>