发明名称 Conductive lead arrangement.
摘要 <p>A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive are of the first surface.</p>
申请公布号 EP0303873(B1) 申请公布日期 1993.12.22
申请号 EP19880112344 申请日期 1988.07.29
申请人 NORTH AMERICAN SPECIALTIES CORP. 发明人 SEIDLER, JACK
分类号 H01R4/02;H01R12/57;H01R24/60;H01R43/02;H01R43/16;H05K3/34;(IPC1-7):H01R9/09 主分类号 H01R4/02
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