| 摘要 |
PURPOSE:To provide the parts mounting device with a dispenser which can apply an adhesive while correcting the position of an applying needle and simultaneously mounts chip parts. CONSTITUTION:This device has an applying means including the dispenser for applying the adhesive or solder onto a printed circuit board, a camera 15 for recognizing the image of the applying needle position of the dispenser and a means for setting the correct position by calculating the deviation between the image obtd. by this camera and a reference line and correcting the position of the applying needle. Further, the device is juxtaposed with the device for applying the adhesive and mounting the parts by moving a working head 14 to a parts supply corner 18, attracting the desired parts by means of a mounting device 14b, picking up the image of the parts attraction state similarly by means of the camera 15 for image recognition, calculating the deviation of the parts attraction position and setting the correct parts mounting position by correcting the previously stored reference mounting position. |
