| 摘要 |
PURPOSE:To prevent a wire from being cut by setting its proper tension simply in a wire bonding apparatus which is used to bond the wire to a substrate. CONSTITUTION:A wire is gripped and held by means of a first hand 28 and a second hand 33 at an interval (L+DELTAL) which includes the stretch portion of the wire in a bonding operation. A CPU as a control part moves the second hand 33 at a speed of V2 so as to obtain the target tension F0 of the wire according to the tension of the wire which is detected by means of a sensor. |
