| 摘要 |
PURPOSE:To make the multiple input/output steps using single frame feasible by a method wherein multiple pairs of PNP type transistor chips and output controlling IC chips are mounted on the same lead frame. CONSTITUTION:A single PNP type transistor chip 1 only is die-bonded in electrically connected state to a chip mounting part 8a to be the voltage part of a single lead frame 8 so as to be led to an output-putting lead terminal integrated with the chip mounting part 8a. On the other hand, the other respective PNP transistor chips 1 in bonded state to an individual metallic sheet 9 can be attached to the chip mounting part 8a. Besides, said transistor chips 1 are individually led to corresponding outputting lead terminal through the in termediary of respective metallic sheets 9 and metallic wires 4. Through these procedures, the title regulator is to be multiple input/output structured while using the single lead frame 8. Furthermore, the thermal breakdown of the transistor chips 1 can be avoided. |
