| 摘要 |
PURPOSE:To prevent invasion of water from a gap between leads and sealing resin after a package is sealed and to effectively prevent cracks at a sealing resin layer, etc., by forming an electrodeposited resin layer covering the gap between the leads and the resin by electrodepositing. CONSTITUTION:A semiconductor integrated circuit 6 is mounted on an island 1 of a lead frame having the island 1 formed at a center and leads 2, 3 formed on a periphery of the island 1. The circuit 6 is connected to the leads 3 via wire bondings 7. Particularly, an insulating resin layer 5 covering a gap between the leads 3 and sealing resin 8 is formed on a boundary between an interior of a package and an exterior when the frame is package-sealed with the resin 8 by electrodepositing with a part except a part to be electrodeposited of the lead 3 as a mask. Thus, after package-sealing, invasion of water from a gap between the leads 3 and the resin 3 can be prevented. |
