| 摘要 |
PURPOSE:To prevent the sucking-up of excessive solder to an end surface electrode at the time of mounting, and ensure the solder amount necessary to connect a mounting electrode with the end surface electrode. CONSTITUTION:The title device consists of a package substrate 1 having a plated end surface electrode 2 on the side surface, a semiconductor element 8 fixed on a package substrate 1, and resin 3 for sealing the semiconductor element 8. A region to obstruct soldering is formed especially at the central part of the end surface electrode 2. That is, solder resist 4 is formed on the part upper than the central part of the end surface electrode 2 whose solderability is improved by gold plating or solder plating. Thereby the sucking-up of the solder 5 toward the upper direction of the end surface electrode 2 can be prevented, so that the solder amount for connecting the mounting electrode 6 with the end surface electrode 2 becomes sufficient. |
