| 摘要 |
PURPOSE:To liberate and remove stress generated at the time of manufacturing a bonding sheet in order to prevent a size change inside a process at the time of manufacturing a multilayer printed wiring board. CONSTITUTION:Prepreg 2a obtained by performing coating of epoxy resin in an epoxy resin tank 3 and drying thereof in a drying tower 6 on a running glass cloth 2 is supported and fixed by means of two pieces of pinch rollers 9, 10 in its horizontally running part, and heat treatment is performed on the slack part 2a1 formed between them by a far infrared ray furnace 11 so as to liberate and remove stress generated on the prepreg 2a during coating and drying in the molten and semisolidified state of the prepreg 2a in order to perform secondary molding having this prepreg as a bonding sheet. |
