发明名称 EQUIPMENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PURPOSE:To speed up the carriage of a substrate in an electronic component mounting line by preventing the substrates from colliding with each other between adjacent conveyors and to prevent the substrate from being rubbed by a rotating belt and thereby damaged while the substrate is standing by at a stand-by position on a front conveyor. CONSTITUTION:A front conveyor 8 is provided with lifting boards 58 and 59 for lifting from on a belt 30 a substrate S which is standing by at a stand-by position (b) or (c) on the front conveyor 8. The lifting boards 58 and 59 are so installed that they may be elevated freely by elevation devices 50 and 51.
申请公布号 JPH05335788(A) 申请公布日期 1993.12.17
申请号 JP19920136530 申请日期 1992.05.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIDESE WATARU
分类号 B23P21/00;B65G43/00;B65G43/08;B65G47/52;H05K13/02 主分类号 B23P21/00
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