| 摘要 |
PURPOSE:To reduce the contact resistance of a semiconductor package by accommodating a semiconductor element in an accommodation part, and forming an electric conduction part for connecting the accommodation part side end portion of a wiring layer with the bottom surface side end portion of an insulating base body. CONSTITUTION:For example, in the case that a semiconductor element is a field effect transistor 4, an insulating base body 2 having an accommodation part 5 for accommodating the field effect transistor 4 is prepared. Wiring layers 3a-3c for connecting the field effect transistor 4 are formed. The one end of the wiring layer is arranged in the accommodation part 5, and the other end of the wiring layer is arranged on the bottom surface of the insulating base body 2. The wiring layers-stretch along the outer peripheral surface of the insulating base body 2. Through holes 6 for directly connecting the accommodation part side end portion of the wiring layer 3 with the bottom surface side end portion of the insulating base body 2 are formed. Thereby the noise figure and the gain of the field effect transistor 4 can be optimized when the resistance value of the wiring layer 3a is decreased. |
