发明名称 CERAMIC MULTILAYER WIRING BOARD AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To adjust capacitance, and manufacture a ceramic multilayer wiring board having a high yield by providing a trimmed capacitor on an inner layer sandwiched between a number of ceramic substrates. CONSTITUTION:A capacitor upper electrode 16 with one side thereof formed into a comb tooth shape is printed on an upper part of a dielectric material 14, and it is calcined after having been dried. A probe is brought into contact with an area between a capacitance check pad 12b of a lower electrode 12a and the electrode 16 to check the capacitance of the capacitor. When the capacitance is outside of a tolerance, the upper electrode 16 is trimmed by a laser beam or the like, so that a trimmed portion 16a is formed. Thereafter, joint glass 18 is printed on a substrate, and an alumina substrate 20 is laminated on the glass. This laminated substrate is then calcined. Thereby, it is possible to manufacture with a high yield a ceramic multilayer wiring board on which a capacitor with its capacitance prepared is mounted.</p>
申请公布号 JPH05335746(A) 申请公布日期 1993.12.17
申请号 JP19920134546 申请日期 1992.05.27
申请人 MITSUBISHI MATERIALS CORP 发明人 HIROSE EIICHIRO;INUI SHINICHIRO
分类号 H01G4/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01G4/12
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