| 摘要 |
PURPOSE:To always monitor a film thickness of a plated material during a plating step by calculating data of a current pattern at a normal time to store a measured value of a current of electroplating and monitoring the plating current. CONSTITUTION:The electroplating apparatus comprises a memory circuit 12 having a shunt resistor 6 interposed at an intermediate part of a lead 5 to store a current value measured through the resistor 6 in a time series, and a comparison deciding unit 11 for calculating data of the current value in the circuit 12 and a measured current value during plating and having a deciding circuit 13 for deciding the calculated value. Thus, since a film thickness of the plated material can be always inspected during a plating step, it is not necessary to remove an IC lead frame and to measure its thickness at each time and easy to check uniform plated layer. Its yield can be reduced. |
