| 摘要 |
PURPOSE:To facilitate the formation of conductor patterns as the relay electrode parts to be formed for the multiplication of the pins in the title lead frame main body as well as for notably enhancing the wire-bondability for the electrical conduction between a semiconductor integrated circuit and the lead frame. CONSTITUTION:In order to manufacture the lead frame, an insulating layer 3 is formed at least in the peripheral end part of an island. Next, the conductor patterns 4 to be, the relay electrode parts is to be formed so as to oppose to inner lead by transfer step using a plating pattern on the peripheral end part. |
