发明名称 METHOD OF FABRICATING PACKAGE
摘要 PURPOSE:To form an electrode lead wire which has low cost and high reliability by forming the lead electrode at an element formed with electrode terminals for external connection on the surface by a plating process. CONSTITUTION:A resist 10 is coated on a resin film 1 coated with a metal film. Then, there is formed a pattern 10' outer peripherally extended to an element 4 containing the region of the electrode terminal 5 of the element 4 around an opening 2 as a center. Then, the element 4 on which a metal film 6 containing an electrode terminal 5 and a resist film 7 having openings 8, 9 are formed is adhered with conductive adhesive 11 while the opening 2 is superimposed with the opening 9. Thereafter, with a metal film 3 as one electrode copper or the like is plated electrolytically on the element to form a plated layer 12 thereon. Then, the resists 7, 10 and films 3, 6 are etched and removed to form electrode lead wires 12. Thus, since the resin film is not damaged for reuse, it can reduce the cost of material in a package.
申请公布号 JPS55124246(A) 申请公布日期 1980.09.25
申请号 JP19790032801 申请日期 1979.03.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HATADA KENZOU;KAJIWARA KOUSEI
分类号 H01L21/60 主分类号 H01L21/60
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