发明名称 MANUFACTURE OF SEMICONDUCTOR MEMORY DEVICE
摘要 PURPOSE:To enhance a contact hole in margin for letting a capacitor plate electrode penetrate when the contact hole is bored for a lead-out wire which leads out the capacitor plate electrode. CONSTITUTION:A contact hole 45 which is used for both a dummy word line 37 and a dummy memory node electrode 47 and the dummy electrode 47 are formed at a point where a contact hole 17 for a lead-out line 13 of a plate electrode 12 of a capacitor 11 which constitutes a memory cell is bored. Therefore, a recessed step is previously formed at a point where the contact hole 17 is bored, so that interlayer insulating films 24, 25, and 26 become apparently thick in a vertical direction. Therefore, the contact hole 17 is nearly equal to a contact hole 16 of a bit line 14 in depth, and consequently the contact hole 17 becomes large in margin for letting the plate electrode 12 penetrate by overetching the electrode 12.
申请公布号 JPH05326875(A) 申请公布日期 1993.12.10
申请号 JP19920155981 申请日期 1992.05.22
申请人 SONY CORP 发明人 KAJIYAMA HIDETO
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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