发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE, WIRE BONDING DEVICE AND WIRE BONDING METHOD FOR SEMICONDUCTOR CHIP USING THEREOF
摘要 PURPOSE:To firmly stick a die-pad to a die-pad receptacle by forming a slit on both side edges of the base part of a suspension lead. CONSTITUTION:Slits 9a and 9b, having a notch on the circumference of the die pad 2 of a hanging lead 5, are formed on both side edges of the base part 5a of the hanging lead which is connected to the four corners of the die pad 2. On the other hand, a cavity 17 having an inclined bottom face is provided on the placing surface 13A of the heat adaptor 14A of a bonding stage 10A. A lead frame 1A is placed on the placing surface 13A, and the connection side of each hanging lead 5 is clamped to a clamping surface 11 using each clamp 18. At this time, the stress, which is generated by the difference between the depth from clamping surface of the placing surface 13A and the depression depth of the die pad 2, is transmitted to the lead 5, each base part 5a goes down into each cavity 17, and the die pad 2 can be firmly stuck to the die pad receiving portion 16 in a stable manner.
申请公布号 JPH05326812(A) 申请公布日期 1993.12.10
申请号 JP19920134062 申请日期 1992.05.27
申请人 SONY CORP 发明人 SAKAMOTO SATORU
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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