| 摘要 |
<p>PURPOSE:To avoid the shortcircuit of terminals or between electrodes by a method wherein terminals of a mounting substrate are arranged inside the trenches formed in the mounting surface. CONSTITUTION:The first and second outer terminals 2B spaced away from each other on the mounting surface of a base substrate 2 are arranged inside the first and second terminals 2B in depth greater than the thickness of the outer terminals 2B separately formed on the mounting surface. Next, the first and second electrodes 6A, 6C are connected to the first and second outer terminals 2B through the intermediary of the solder pasts formed in the first and second trenches 2A in the state wherein the region between the first and second outer electrodes 6A and 6C of a chip capacitor 6 is in contact with the mounting surface of the base substrate 2 between the first and second trenches 2A. Through these procedures, the solder balls produced during the solder reflow can be prevented from entering the gap between the mounting surface of the base substrate 2 and a chip capacitor element 6.</p> |
