| 摘要 |
<p>PURPOSE:To prevent generated plasma from getting around into a rear face of a substrate to be treated during plasma treatment. CONSTITUTION:Due to a vacuum exhaust pipe 3 which is installed in a substrate holder 2, a rear face of a substrate to be treated 1 is sucked and held in such a vacuum degree region that no plasma may be generated. In addition to vacuum suction and holding, an electrostatic chuck 4 is also used.</p> |
