| 摘要 |
PURPOSE:To provide a printed wiring board which can prevent lowering of connection strength between a bonding pad and a wire even if silver paste flows when a light emitting diode element is mounted on a die pad whereto silver paste is applied. CONSTITUTION:Die pads 2, 4 whereon a light emitting diode element is mounted by silver paste and bonding pads 6, 8 connected to a first pad of the light emitting diode element through a wire are connected by a connection pattern 10 which is longer than a flow distance of silver paste. |
