| 摘要 |
PURPOSE:To realize the stable formation of bumps on an IC, on which the height of the bumps is formed high, the diameter of the bumps is formed small and the pitch between the bumps is made narrow. CONSTITUTION:A capillary for bump formation use, which is constituted by making a wire 22 penetrate through the capillary centering around a wire hole 23, through which the wire 22 passes, is formed in such a way that the point part of the hole 23 is vertically opened on the side of the bottom of the capillary, is directly connected with the bottom and the diameter of the point of the hole 23 becomes equal with the diameter of the wire 22 to pass through the hole as close as possible. |
