| 摘要 |
PURPOSE:To provide a solder bonding method in which a solder ball, having no oxide on the surface thereof, can be formed at a cut end of solder wire. CONSTITUTION:Works, e.g. a lead frame 5, 8 capacitor element 1, are passed through a tunnel space 10 defined by a heater block 7 and an upper cover body 9 having an opening 11 communicated with the interior of tunnel section 4. A capillary tool 12, through which 6 solder wire 2 penetrates, is disposed at the opening 11 so that the capillary tool 12 can move up and down. Reducing gas is introduced into the tunnel space while oxyhydrogen flame is blown from a torch 13 into the tunnel space to fuse the solder wire 2 in the way thus forming solder balls 2a, 2b at the opposite cut ends. The balls are then bonded to the work thus performing wire bonding. |
