| 摘要 |
<p>PURPOSE:To provide an IC socket having a mechanism possible to radiate heat, generated in an LSI, to a multilayer printed board and the multilayer printed board efficiently absorbing heat from this IC socket to radiate into the air. CONSTITUTION:In an IC socket 9, elastic units 16a, 16b of high thermal conductivity of silicone rubber or the like are laminated to a thin thickness on both surfaces of a metal plate 15 having high thermal conductivity like copper or the like as a heat conductor 11, in the central part of an IC socket main unit 10. The heat conductor 11 is formed in thickness larger than the thickness of the IC socket main unit 10, and the heat conductor 11 is constituted such that its lower surface forms a protrusive part slightly protruded from the IC socket main unit 10 to fix a lower end part of the heat conductor 11 fitted to a recessed part of the printed board. The heat conductor 11 is constituted such that its upper surface is protruded a little from a surface of the IC socket main unit 10 to support an LSI by the elastic unit 16a in an upper surface side of the metal plate 15.</p> |
