| 摘要 |
<p>PURPOSE:To thin a multilayer board without deteriorating the high frequency characteristics. CONSTITUTION:A multilayer board is provided by forming circuit interconnection, etc., on the inner layer of a dielectric board which deals with a high frequency signal. The inner layer conductor pattern is formed so as to keep the distance between a signal transmitting line pattern 11 formed on a surface layer conductor mounted with a circuit component 10 and inner layer conductor patterns 12 and 13 to be more than the distance between the surface layer conductor 11 and a rear layer conductor ground pattern 14.</p> |
