| 摘要 |
<p>PURPOSE:To arrange a variety of large-sized marks in a scribe region without reducing the logical yield of an integrated circuit chip, in a semiconductor wafer where a variety of marks such as an alignment mark, etc., are formed inside a scribe region. CONSTITUTION:One part of a scribe region 11 is expanded in this vacant region, making use of the vacant region between the bonding pads 15 on the side of an integrated circuit chip region 13, and a variety of marks are formed in the expanded scribe region The width of the scribe region 11b where a variety of marks 16 are not made is set to be an indispensable minimum width.</p> |
