LAND PATTERN FOR INTEGRATED CIRCUIT

摘要

PURPOSE:To provide a land pattern for an integrated circuit of high quality in which an open malfunction of soldering to be effectively mounted electrically and in strength on a printed board of the circuit does not occur. CONSTITUTION:A structure in which a slit 9 formed along a direction perpendicular to the direction of leads 11 is formed is provided at the center of a land pattern 8 to be fixed with leads of an integrated circuit 10 in a land pattern 8 for mounting the circuit 10 on a printed board 7. A sufficient amount of solder 12 remains between the pattern 8 and the leads 11 by dividing its flow at the slit 9 to rigidly fix the both.