| 摘要 |
<p>PURPOSE:To improve the solderability of an LSI lead (especially when there is microscopic deformation in upward direction of the lead) and to conduct a visual inspection in a reliable manner. CONSTITUTION:A slit 7 or a small hole 8, having the width and the length less than the length of the soldering part of a lead necessary to suck up fused solder by capillarity to the soldering part 4 of the lead 3, is provided on the lead 3.</p> |
