| 摘要 |
<p>PURPOSE:To provide a photocoupler with quality plating by using a recent, automated plating system without the need of two separate operations. CONSTITUTION:A photocoupler includes a lead frame 100 at its emitter side and a lead frame 200 at its receiver side, and the two lead frames are combined and joined by a rivet 500 for electrical connection. The electrical connection between the two lead frames is performed after the headers 140 and 240 of the lead frames 100 and 200 are molded.</p> |
