| 摘要 |
<p>PURPOSE:To simplify the wiring structure of a semiconductor chip and a lead conductor while the wiring structure is reduced in weight and thickness. CONSTITUTION:A lead frame 17, consisting of a tab part 15 connected to the grounding potential through a ground lead 12 and a plurality of signal leads 10, is adhered at least to one surface of a tab part 15, and a hole 8 for earthing is formed in the prescribed position. An insulating tape 13, on which a conductive pattern 5 is formed on the surface, and a number of semiconductor chips 1, which are arranged in the prescribed positions of the insulating tape 13, are provided. A semiconductor chip 1 is connected to the signal lead 10 through the conductive pattern 5, and it is connected to the tab part 15 through the hole 8.</p> |
