发明名称 SEALING AND MOLDING DEVICE FOR ELECTRONIC COMPONENT WITH RESIN, AND RELEASING METHOD FOR MOLDED ITEM FROM MOLD
摘要 PURPOSE:To improve the mold releasing property of a molded item sealed with resin and the adhesive property between the molded item sealed with resin and a lead frame. CONSTITUTION:A cavity face 19 and a molded item 29 sealed with resin are separated easily by adding required vibration to the cavity face 19, and constituting a thin air layer at the boundary face between the cavity face 19 and the molded item 29 sealed with resin thereby putting both sides in noncontact condition so as to release the pressure-bonding condition of both sides. Moreover, the mold releasing action of the molded item sealed with resin is assisted by supplying compressed air between both sides of the cavity face 19 and the molded item 29 sealed with resin. Furthermore, the cavity face 19 and the molded item 29 sealed with resin are separated easily within a resin hardening time by adding required vibration to the cavity face 19 immediately after the finish of the process of injecting resin into the cavity 19, or immediately before the finish of the process of pressurizing the resin charged inside the cavity, or immediately after the finish of the process of pressuring the charged resin.
申请公布号 JPH05326597(A) 申请公布日期 1993.12.10
申请号 JP19920154286 申请日期 1992.05.20
申请人 TOOWA KK 发明人 OSADA MICHIO
分类号 B29C45/02;B29C45/14;B29K105/20;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
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