| 摘要 |
PURPOSE:To keep mui, L, and Q at high levels in core and laminate chip inductor while keeping power loss of core at a low level. CONSTITUTION:The sintered ferrite is composed of Ni-Cu-Zn, Ni-Cu, Ni-Zn, or Cu-Zn based ferrite added, at material stage, with 8-90ppm of P expressed in terms of P. The chip inductor component 3 is composed of a laminate of a ferrite magnetic layer 31 and inner conductors 35 wherein the ferrite magnetic layer 31 is composed of sintered ferrite. The composite laminate component is composed at least of the chip inductor component 3 and the core is composed of the sintered ferrite. |
