MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To obtain a manufacturing method of a multilayer printed wiring board which is simple and convenient and ensures high precision in positions of a plurality of printed wiring boards. CONSTITUTION:In a manufacturing method of a multilayer printed wiring board wherein a plurality of printed wiring boards 1a and 1b are subjected to thermocompression bonding with a bonding sheet 2a interlaid, conductor parts 4 of the printed wiring boards 1a and 1b in a plurality are joined mutually beforehand by soldering 3 and then subjected to the thermocompression bonding.