| 摘要 |
PURPOSE: To provide a method, without using chemical etching, for making a through-hole for an electric connection which passes through an electric circuit package of a solar battery, etc., and which has good adhesion with both a base and a conductive metallic layer. CONSTITUTION: This method is characterized in that a first through-opening 40 is formed in a base 34 and then the first through-opening 40 is covered and filled with a dielectric material 42. After that, a second through-opening 44 is formed in the dielectric material 42, and then the dielectric material 42 is coated with a conductive material layer 46 which is insulated from the base, by means of the dielectric material 42. Thus a through-hole for an electric connection is formed. For the dielectric material 42, polyimide or other such material is used. The material is used in a liquid state first and then is heated to be hardened into a solid state, after it has covered and filled an opening 44. |
