发明名称 FORMING METHOD OF CAPACITOR OF SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To enable a capacitor to be more enlarged in surface area than usual through a simple manufacturing method where the capacitor and its lower electrode of a semiconductor element such as a DRAM are formed. CONSTITUTION:Si is epitaxially grown through an ELO(Epitaxial Lateral Overgrowth) method into a trapezoidal Si layer 6 possessed of a slope filling a contact hole 10, the trapezoidal Si layer 6 serves as a lower electrode 6 of a capacitor, and a capacitor insulating film 7 is formed on the lower electrode 6. Moreover, an insulating film 5 formed on the contact hole 10 is removed, whereby the Si layer 6 is turned into a mushroom-type 6a which functions as a lower electrode wider in surface area.
申请公布号 JPH05326881(A) 申请公布日期 1993.12.10
申请号 JP19920133483 申请日期 1992.05.26
申请人 OKI ELECTRIC IND CO LTD 发明人 YOSHIMARU MASAKI;YAMAUCHI SATOSHI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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