| 摘要 |
PURPOSE:To improve heat dissipation by forming a pattern for heat dissipation connected with a main substrate on which a hybrid integrated circuit device is mounted, on the rear of an organic substrate. CONSTITUTION:A spot facing is formed in an organic substrate (glass epoxy substrate) 1, and an IC chip 6 is bonded and mounted by using adhesive resin 5. The IC is electrically connected with an electrode pattern 2 formed on the glass epoxy substrate 1 by using Au or aluminum wires 7. The inside of a resin frame 4 which is previously mounted on a protective body 3 is sealed by using resin 8. A connection pattern 12 for heat dissipation is formed on the rear of the glass epoxy substrate 1. A hybrid integrated circuit device is mounted on a main substrate 11 by using solder 9 as shown in figure. Connection lands 10, the electrode pattern 2, and the connection pattern 12 for heat dissipation are connected by using solder 9 for mounting. Thereby heat dissipation effect is improved. |
