| 摘要 |
PURPOSE:To obtain a semiconductor laser device wherein the manufacturing cost is low, the freedom of shape of a light beam reflecting surface formed on a semiconductor substrate is high, and the device thickness can be reduced. CONSTITUTION:A semiconductor laser chip (laser diode 2) is fixed on a metal base (block 1), and a reflecting surface 3 for reflecting a light beam from the laser chip in the necessary direction is formed on the base. Thereby the freedom of shape of the reflecting surface 3 is increased. By outputting the light beam from a semiconductor laser device via the reflecting surface 3, the size of a device in the light emission direction is reduced. By simplifying the constitution, the manufacturing cost is lowered. |
