| 摘要 |
PURPOSE:To reduce a surface uneveness of a wafer by a method wherein, in a wafer which is ground by rotating it on the sand cloth surface, it is ground in such a condition that a thinner ring than a finishing thickness is mounted around the periphery of the wafer. CONSTITUTION:A grinding cloth 2 is attached onto the upper surface of a fixed board 1 having the flat surface having a sufficiently large diameter, and a solid plate 4 to which a plurality of wafers are adhered is pressurized by a specific force W from its back side, while it is rotated and vibrated on the grinding cloth 2 surface to grind the one surface of a wafer 3. In such grinding method, a ring 5 is mounted in the periphery of the wafer 3. A thickness t of the ring 5 is selected as a value satisfying t<=w-s wherein a thickness of the wafer 3 is w and its grinding amount is s. Thus, in a distribution of a counterforce P to be received from the grinding cloth 2 of the wafer 3, an increase degree in the counterforce P to be received in a peripheral part 3b towards a central part 3a is made smaller and a surface unevenness of the wafer 3 is reduced. |
